EXPLORING THE STRUCTURAL MECHANICS OF TITANIUM NICKEL SOLID ALLOY USING COMSOL MULTIPHYSICS: A POISSON EQUATION AND CONTINUITY EQUATION PERSPECTIVE

Authors

  • P.J. Manga Department of Physics, University of Maiduguri, Borno State,
  • Mohammed Maina Department of Chemical Engineering, Ramat Polytechnic Maiduguri, Borno State,
  • Samaila H. Department of Physics, University of Maiduguri, Borno State,
  • E.W. Likta Department of Physics, University of Maiduguri, Borno State,
  • R.O. Amusat Department of Physics, University of Maiduguri, Borno State,
  • S. Daniel Department of Science Laboratory Technology, Abubakar Tatari Ali Polytechnic, Bauchi State,

Abstract

This study investigates the structural mechanics of titanium-nickel (Ti-Ni) alloy thin film using computational modelling through COMSOL Multiphysics based on Poisson’s equation and continuity equation for stress check by considering its linear elastic, conservation of charge and providing insight into nanomaterial deformation. In the COMSOL environment the parameters for titanium nickel (Ti-Ni) are embedded in the COMSOL Simulink interface. The Thin film layer was designed by defining the layer geometry of the size and shape of the layer with a width of , depth of  and height of  subjected to boundary conditions such as von – mises stress, surface temperature, iso-surface temperature, multi-slice electric potential, displacement component, surface elastic strain energy density and total enthalpy.  The results displayed a trend that is, as the surface temperature increases there will be an increase in the current densities associated with high electrical conduction. On the same note, the designed thin film layer will pass the percolation threshold. The results of surface elastic strain energy density and total enthalpy imply that the designed thin film layer is effective and efficient as a structural pseudopotential device (photodiode).

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Published

2024-03-31

Issue

Vol. 19 No. 1 (2024)

Section

ARTICLES